Intel EMIB Technology Breakthrough

$INTC Intel has achieved a major milestone with its EMIB advanced packaging technology, hitting ~90% yield, which analysts view as a significant foundry breakthrough and a competitive edge against TSMC’s CoWoS which is COMPLETLY MAXED OUT. -EMIB-M: Focuses on efficiency with MIM capacitors for better power delivery and noise reduction. -EMIB-T: Adds TSVs (Through-Silicon Vias) for direct power routing through the bridge, enabling higher performance for AI accelerators. It supports easier integration of IP from other packaging designs and is optimized for high-bandwidth memory (HBM). -Current/near-term (EMIB-T): >8x reticle size in 120x120mm packages, supporting 12 HBMs, 4+ dense chiplets, and >20 bridges. -By 2028: Scales to >12x reticle size in >120x180mm packages, with >24 HBM dies and >38 EMIB-T bridges. EMIB is gaining traction with hyperscalers: Google is reportedly using it for next-gen TPUs (e.g., TPUv8e), NVIDIA for Feynman chips, and Meta for a future CPU (late 2028). It strengthens Intel Foundry’s position in the AI packaging race. Advanced Packging is the Moore's Law Going Vertical.