GOOGLGOOGLAlphabet Inc. Class A
$390.45
24h
-2.51%
23 Apr, 14:19

Google TPU drives AI compute cost advantage narrative

Bullish+14.96%

AI Summary

Author discusses institutional narrative shift toward de-NVDA diversification driven by Google TPU announcements, and provides a comprehensive list of AI infrastructure supply chain stocks as potential beneficiaries.

Morgan Stanley raised Google's target price today, mainly because of the new announcements at yesterday's Google Cloud Conference, "TPU will bring AI computing cost advantages" Goldman Sachs also stated "TPU will divert Nvidia's market" It feels like institutions are consciously hyping the narrative of "de-NVDA diversification to spread risk" Alright, let's look at the supply chain concept stocks 1. Optical Modules and High-Speed Interconnect Chips Optical Module Assemblies and Devices COHR (Coherent) AOI (Applied Optoelectronics) LITE (Lumentum) http://06166.HK (Cambridge Industries) DSP and High-Speed Interconnect Chips MRVL (Marvell Technology) CRDO (Credo Technology) Analog Optoelectronic Chips SMTC (Semtech) MTSI (MACOM Technology Solutions) Precision Contract Manufacturing and Assembly FN (Fabrinet) http://06088.HK (FIT Hon Teng) 2. OCS (All-Optical Circuit Switch) Optoelectronic Devices COHR (Coherent) MEMS Micromirrors LITE (Lumentum) Ultra-High Precision Contract Manufacturing and Assembly FN (Fabrinet) 3. Liquid Cooling / Heat Dissipation VRT (Vertiv Holdings) MOD (Modine Manufacturing) NVT (nVent Electric) 4. Server Power Supply MPWR (Monolithic Power Systems) AEIS (Advanced Energy Industries) VICR (Vicor Corporation) http://02577.HK (Innoscience) 5. PCB TTMI (TTM Technologies) http://02476.HK (Victory Giant Technology) 6. CPU ARM (Arm Holdings) 7. Memory 07747.ETF (CSOP 2x Daily Long Samsung Electronics) 07709.ETF (CSOP 2x Daily Long SK Hynix) MU (Micron Technology) SNDK (SanDisk) 8. Others (Design, Testing, and Complete Machines) ASIC Chip Design and IP AVGO (Broadcom) Wafer Foundry and Advanced Packaging TSM (TSMC) AMKR (Amkor Technology) System Assembly and EMS Contract Manufacturing CLS (Celestica) JBL (Jabil) FLEX (Flex) Semiconductor Wafer Testing and Probes FORM (FormFactor) 9. MPO and AOC (High-Density Interconnect Cables) APH (Amphenol) TEL (TE Connectivity) GLW (Corning) http://01729.HK (Huiju Technology) http://06869.HK (Yangtze Optical Fibre and Cable)

More Views About GOOGL