$390.45
24h
-2.51%
23 Apr, 14:19
Google TPU drives AI compute cost advantage narrative
Bullish+14.96%
AI Summary
Author discusses institutional narrative shift toward de-NVDA diversification driven by Google TPU announcements, and provides a comprehensive list of AI infrastructure supply chain stocks as potential beneficiaries.
Morgan Stanley raised Google's target price today, mainly because of the new announcements at yesterday's Google Cloud Conference, "TPU will bring AI computing cost advantages"
Goldman Sachs also stated "TPU will divert Nvidia's market"
It feels like institutions are consciously hyping the narrative of "de-NVDA diversification to spread risk"
Alright, let's look at the supply chain concept stocks
1. Optical Modules and High-Speed Interconnect Chips
Optical Module Assemblies and Devices
COHR (Coherent)
AOI (Applied Optoelectronics)
LITE (Lumentum)
http://06166.HK (Cambridge Industries)
DSP and High-Speed Interconnect Chips
MRVL (Marvell Technology)
CRDO (Credo Technology)
Analog Optoelectronic Chips
SMTC (Semtech)
MTSI (MACOM Technology Solutions)
Precision Contract Manufacturing and Assembly
FN (Fabrinet)
http://06088.HK (FIT Hon Teng)
2. OCS (All-Optical Circuit Switch)
Optoelectronic Devices
COHR (Coherent)
MEMS Micromirrors
LITE (Lumentum)
Ultra-High Precision Contract Manufacturing and Assembly
FN (Fabrinet)
3. Liquid Cooling / Heat Dissipation
VRT (Vertiv Holdings)
MOD (Modine Manufacturing)
NVT (nVent Electric)
4. Server Power Supply
MPWR (Monolithic Power Systems)
AEIS (Advanced Energy Industries)
VICR (Vicor Corporation)
http://02577.HK (Innoscience)
5. PCB
TTMI (TTM Technologies)
http://02476.HK (Victory Giant Technology)
6. CPU
ARM (Arm Holdings)
7. Memory
07747.ETF (CSOP 2x Daily Long Samsung Electronics)
07709.ETF (CSOP 2x Daily Long SK Hynix)
MU (Micron Technology)
SNDK (SanDisk)
8. Others (Design, Testing, and Complete Machines)
ASIC Chip Design and IP
AVGO (Broadcom)
Wafer Foundry and Advanced Packaging
TSM (TSMC)
AMKR (Amkor Technology)
System Assembly and EMS Contract Manufacturing
CLS (Celestica)
JBL (Jabil)
FLEX (Flex)
Semiconductor Wafer Testing and Probes
FORM (FormFactor)
9. MPO and AOC (High-Density Interconnect Cables)
APH (Amphenol)
TEL (TE Connectivity)
GLW (Corning)
http://01729.HK (Huiju Technology)
http://06869.HK (Yangtze Optical Fibre and Cable)